65nm CPUs and improved heatsink in Halo 3 LE Xbox 360

Posted Oct 1, 2007 at 4:24AM by QJ Staff Listed in: Xbox 360 Tags: GPU, Microsoft, Ring of Death
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65nm CPUs and improved heatsink in Halo 3 LE Xbox 360 - Image 1Online site DailyTech reports that an Xbox 360 owner with a gamertag of JWSpeed dissected his new Halo 3 Limited Edition console and found out that it came with the long-promised 65nm CPUs.

Aside from that, the said gamer also noticed a simplified heatsink design for the console. For so long now, gamers have been requesting Microsoft for a solution to the overheating problem suffered by the Xbox 360.

While the company has yet to publicly discussed the issues surrounding the Red Ring of Death, it is a common and popular belief that this is due to the 90nm CPUs' lack of cooling capabilities.

Aside from the already mentioned advantage, shifting to 65nm CPUs will also save Microsoft some money. These chips are smaller and 50% less expensive to manufacture. It is unsure until now, however, whether the GPU has also been moved to 65nm.

Via DailyTech

 
 
 

Comments [refresh]

by Mister Common Sense - 2007-09-30 23:39
» Cool!

I knew they would have the new chips around Halo 3 time!



I wonder if the premimum consoles also have it...

by Mister Common Sense - 2007-10-01 00:08
» doh!

I was disapointed to read the GPU is still the same. The CPU never really had overheating problems. Looks like this is a cost reducing measure, as the cooler running CPU doesn't need the expensive copper heatsink. Hopefully the 65nm GPU is coming soon.

by DVSDevise - 2007-10-01 02:00
» ...

Well test have proven that the 360 is running 40% cooler then the old models. The GPU still has a second heatsink to cool the GPU, along with better eproxy for better chip connectivity. I expect failure rates to drop dramatically.

by BrendanL - 2007-10-01 10:47
» Didn't they prove that these were the 90 nm...

Didn't they prove that these were the 90 nm processing units but in a different case?

by Shatterdome - 2007-10-01 12:03
» Yeah...

Until official word from MS, this could just be a revised cooling system.



They didn't actually take a look at the chip directly, and MS hasn't confirmed anything...

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