Though it isn't from an official press statement, Chinese broadsheet Commercial Times reports that Foxconn Electronics (Hon Hai Precision Industries) just landed orders to build the next generation of iPhones touting 3G connectivity.

In addition, the company, who has been the principle manufacturer for the first generation of Apple iPhones, is expected to ship the first 3G batch by June 2008.

According to investors in Taipei, the Taiwan-based computer hardware manufacturer is anticipated to get three million units out in June, and that they foresee 24 to 25 million units being shipped by Hon Hai Precision.

This development was also reinforced by whispers from suppliers of iPhone components, which tell that Apple has asked them to prep a ready supply by May 2008. An earlier report by DigiTimes places UMC, or the United Microelectronics Corporation, as the one responsible for producing the 3G iPhone baseband chips.

Now what makes this particularly worthy of note is the speculation that the manufacturing will begin as soon as Apple announces the 3G iPhone iteration at the upcoming Worldwide Developers Conference (WWDC) 2008 which is also interestingly scheduled in June.

There has been a high demand for a 3G-capable iPhone and the time they would announce the 3G version - approximately one year after the first iPhone - is ample time to release a new version.